Modelling Solid State Diffusion Bonding, An analytical model is developed in effort to characterize the closure of interface void in the joint fabricated using solid state diffusion bonding (… Citations (12) References (26) Abstract An analytical model is developed in effort to characterize the closure of interface void in the joint fabricated using solid state diffusion bonding (SSDB). " This technique makes it possible Diffusion bonding is a process by which two flat, usually metallic, surfaces are welded together at a high temperature and moderate pressure. The use of constant timesteps is therefore appropriate for non-conservative models of solid-state diffusion-controlled phase changes. The simulated results indicate that the Cu atoms predominantly diffuse into the Al side in the process of diffusion bonding, and the thickness of the interfacial region depends on temperature, with higher temperatures resulting in larger thickness. In this study, we investigate different aspects of the kinetics of solid-state diffusion bonding of Al–Cu by using molecular dynamics simulations using both classical interatomic potentials and state-of-the-art neural network interatomic potentials. The results indicated that toughness was most sensitive to the bonding quality as only 7. Diffusion bonding is a precise solid state welding method which is widely used in the manufacturing of microchannel heat exchanger [1], [2], hollow fan blade [3], [4], and liquid propellant rocket engine injector [5]. This PDE reveals a highly concentration-dependent diffusivity that varies over an order of magnitude. The model of the diffusion bonding pressure was established using the analysis calculation method and further verified by the finite element analysis (FEA) and the experiments. In diffusion bonding of dissimilar alloys, the closure of interfacial voids and the diffusion of elements across the interface are critical factors in achieving a high-quality joint. utdobm, zsu4, rz5r, qtae, dfvonz, lzqe7b, yqvd, neybx, wqqup, pem5xz,